LAYER BUILT-UP PROCESS FOR PRINTED CIRCUIT BOARD,申请号KR20000028926-传众专利搜索

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发明名称	LAYER BUILT-UP PROCESS FOR PRINTED CIRCUIT BOARD
摘要
申请公布号	KR20010107414(A)	申请公布日期	2001.12.07
申请号	KR20000028926	申请日期	2000.05.29
申请人	SIMM TECH CO., LTD.	发明人	JUNG, CHANG BO;LEE, SEON YONG;PARK, JEONG GWON;SO, HYEON JU
分类号	H05K3/46;(IPC1-7):H05K3/46	主分类号	H05K3/46
代理机构		代理人
主权项
地址

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