| 摘要 |
PROBLEM TO BE SOLVED: To provide a reflow soldering system in which occurrence of warp in a printed board is suppressed while preventing defective soldering. SOLUTION: The reflow soldering system comprises a box type carrier 3 for carrying a board 2 mounting electronic components 1A, 1B, 1C, a mechanism 4 for carrying the carrier 3, and a reflow furnace 5 for soldering the electronic components 1A, 1B, 1C to the board 2 at specified positions of the carrying mechanism 4 wherein the outer circumferential part of the carrier 3 is formed of a thermal insulation member and heaters 6A, 6B, 6C are disposed in the carrier 3.
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