| 摘要 |
PURPOSE: To make specifiable failures indicated by the failure inspection data obtained by means of an inspection machine as to whether the failure causes a malfunction, within a short inspection time and a short analysis time. CONSTITUTION: In a method for analyzing manufacturing failures of a semiconductor device which has a semiconductor storage device in at least part of the device, steps 21-1, 21-2, and 21-N of collecting pattern failure information by inspecting a pattern formed on a semiconductor wafer, steps 13, 52, 54, and 54 of collecting malfunction information by electrically inspecting the semiconductor device formed on the semiconductor wafer, and steps 41 and 42 of analyzing the manufacturing failure of the semiconductor device by correlating the pattern failure information with the malfunction information are performed in the manufacturing process of the semiconductor device. The semiconductor storage device is provided with a storing section and a redundant section, and the malfunction information contains repair information which replaced to the redundant section. In the analyzing steps 41 and 42, in addition, the repair information is correlated with pattern failure information for analysis.
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