| 摘要 |
PROBLEM TO BE SOLVED: To provide a structure for soldering which can allow a stable installation of an electronic component on a printed board, by preventing a space surrouned by legs of the electronic component from becoming a sealed state to allow the air expanded, or flux gasified, to go outside, due to heat applied at the time of soldering, when soldering the electronic component such as an electrolytic capacitor on the printed board. SOLUTION: A plurality of long and narrow slits 8, 8 are formed through the printed board 2. The electrolytic capacitor 1 is so installed by soldering that parts of the slits may be located below the bottom of the electrolytic capacitor 1.
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