发明名称 CONDUCTIVE RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a high-performance electroconductive resin composition using aluminum. SOLUTION: An electroconductive resin composition of the present invention has characteristics that it contains a body dispersed with an aluminum-based metal, a low melting point metal that melts at molding, a synthetic resin material and an antioxidant consisting at least one among a sulfur-based antioxidant, a vitamin E-based antioxidant and a phenol-based antioxidant with melting point higher than 200 deg.C. In other words, since an oxide film of high-resistance on the surface of the aluminum-based metal dispersed body that obstructs the electrical conductivity can be effectively removed by the action of the above antioxidant, electrical connection of the aluminum-based metal dispersed body and the low melting point metal as a matrix is not obstructed.
申请公布号 JP2001338529(A) 申请公布日期 2001.12.07
申请号 JP20000160066 申请日期 2000.05.30
申请人 TOGO SEISAKUSHO CORP 发明人 SAKAKIBARA KAZUTOSHI
分类号 H05K1/09;C08K3/04;C08K3/08;C08K5/00;C08K7/06;C08L93/04;C08L101/00;H01B1/22;H01B1/24;H05K9/00;(IPC1-7):H01B1/22 主分类号 H05K1/09
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