ELECTRONIC COMPONENT SUCTION NOZZLE AND DIE BONDING APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide an electronic component suction nozzle and a die bonding apparatus wherein, even if there are a plurality f electronic components, a positional difference of the electronic component can be surely detected when each electronic component is sucked and each electronic component can be sucked stably. SOLUTION: The electronic component suction nozzle 8 comprises a nozzle body 11 for sucking a chip component C and a solder foil H and a suction hole 12 is formed in this nozzle body 11. The component suction face 11a of the nozzle body 11 is configured so as to protrude both end parts of the chip component C in a longitudinal direction when the chip component C is sucked. In addition, the suction hole 12 has a slot shape extending in the perpendicular direction (the longitudinal direction of the component suction face 11a) with respect to the direction in which the chip component C is protruded from the component suction face 11a and is configured so as to protrude both longitudinal end parts of the suction hole 12 from the chip component C when the chip component C is sucked to the component suction face 11a.