MOUNTING STRUCTURE FOR SEMICONDUCTOR ELEMENT

摘要

PROBLEM TO BE SOLVED: To provide a both-surface mounting structure for semiconductor element which is improved in the connection reliability between a semiconductor element and a circuit board for repetitive thermal stresses. SOLUTION: A semiconductor element 2 having the same size as another semiconductor element 3 mounted on one surface 1b of a circuit board 1 has is mounted oppositely to the element 3 on the other surface 1a of the board 1. Alternatively, a plurality of small-sized semiconductor elements are arranged oppositely to the element 3 on the other surface 1a so that the mounting area of the elements may become equal to that of the element 3. It is also possible to mold the outer peripheries of the small-sized semiconductor elements mounted on the surface 1a with a resin so that the mounting area of the elements may become equal to that of the element 3. Since the front and rear surfaces of the circuit board 1 are made in nearly same symmetrical structures in this way, the warping of the board 1 due to thermal stresses can be prevented.