SMALL FORMAT OPTICAL SUBASSEMBLY

摘要

A small format optoelectronic package or device (10) includes a non-electrically conductive substrate (40) partially covered by an electrically conductive can (30). The electrically conductive can (30) has a transparent element (20) affixed to an aperture (32) of the electrically conductive can (30). The electrically conductive can (30) encloses and hermetically seals an optical diode (80), and conductors between the electrically conductive can (30) and the non-electrically conductive substrate (40). The non-electrically conductive substrate (40) has two through-holes formed through a thickness of the non-electrically conductive substrate (40). The two through-holes (44, 46) are filled with an electrically conductive material so as to form two electrically conductive vias (44a, 46a). Additionally, a surface of the non-electrically conductive substrate (40) is organized in two regions. The first region (43) has the electrically conductive plating material applied thereto. The first (44) and second (46) through-holes protrudes through the second region (42). The optical diode (80) has a first lead (74) electrically connected to the first via (44a), and the optical diode (80) has a second lead (72) electrically connected to the second via (46a).