| 发明名称 |
POLISHING METHODS AND APPARATUS FOR SEMICONDUCTOR AND INTEGRATED CIRCUIT MANUFACTURE |
| 摘要 |
A method of conditioning a polish pad (202) at the point of polish. In one embodiment, the method comprises several steps. In the first step, polishing slurry is received at a CMP machine (200). Next, a polish pad (202) is rotated. Then, the polish pad is conditioned proximately around a location designated for holding a wafer (205). |
| 申请公布号 |
WO0191969(A2) |
申请公布日期 |
2001.12.06 |
| 申请号 |
WO2001US17774 |
申请日期 |
2001.05.31 |
| 申请人 |
PHILIPS SEMICONDUCTORS, INC.;KONINKLIJKE PHILIPS ELECTRONICS N.V. |
发明人 |
WHITE, NELSON, W., II.;LIU, ALBERT, H. |
| 分类号 |
B24B37/32;B24B53/013;B24B53/017;H01L21/304 |
主分类号 |
B24B37/32 |
| 代理机构 |
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