| 摘要 |
<p>A method of conditioning a polish pad (202) at the point of polish and for dispensing slurry at the point of polish. In one embodiment, the method comprises several steps. In the first step, polishing slurry is received at a CMP machine. Next, a polish pad (202) is rotated. Then, the polishing slurry is dispensed onto a portion of said polish pad (202) located proximately around a location designated for holding a wafer.</p> |
