发明名称 HEAT SINK MODULE AND AN ARRANGEMENT OF HEAT SINK MODULES
摘要 The invention relates to a plate-like heat sink module (1) having a polygon-shaped horizontal projection. A heat-generating component (2) can be fixed to the upper side of said module. The lower side of said module is provided with cooling ribs (3). The outer edges of said module are provided with surface structures which are complementary in relation to one another. Several similar heat sink modules (1) can be joined together in a plane by means of said structures that are configured in such a way that a heat sink module (1) can be joined to another heat sink module (1) in one orientation only. The invention also relates to an arrangement of heat sink modules. A heat sink being used for interconnecting several condensers to form a condenser bank can be produced in a particularly flexible manner by means of the inventive arrangement of heat sink modules.
申请公布号 WO0165899(A3) 申请公布日期 2001.12.06
申请号 WO2001DE00557 申请日期 2001.02.14
申请人 EPCOS AG;HEBEL, RAINER;MICHEL, HARTMUT 发明人 HEBEL, RAINER;MICHEL, HARTMUT
分类号 F28F3/02;F28F7/00;H01G2/08;H05K7/20 主分类号 F28F3/02
代理机构 代理人
主权项
地址