发明名称 |
Method for coating ultra-thin resist films |
摘要 |
There is provided a method for applying a lower viscosity coating liquid onto a semiconductor wafer substrate so as to prevent adhesion loss and to maintain low defect level characteristics. This is achieved by priming the substrate with a bonding agent at a temperature in the range of 18° C. to 50° C. for a short amount of time. This is performed prior to the application of a liquid solvent. As a result, there is overcome the problems of poor adhesion to the substrates and high defect levels in the coated UTR films.
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申请公布号 |
US6326319(B1) |
申请公布日期 |
2001.12.04 |
申请号 |
US20000609746 |
申请日期 |
2000.07.03 |
申请人 |
ADVANCED MICRO DEVICES, INC. |
发明人 |
PIKE CHRISTOPHER L.;NGUYEN KHANH B.;LYONS CHRISTOPHER F. |
分类号 |
G03F7/16;H01L21/312;(IPC1-7):H01F10/02 |
主分类号 |
G03F7/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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