| 摘要 |
PROBLEM TO BE SOLVED: To obtain a cap for a semiconductor laser which facilitates miniaturization of a semiconductor laser. SOLUTION: This cap 10 is formed by the following procedure. A cylindrical can 11 in which a circular window 12 is opened in the central part of a top, a window glass (glass plate) 13 in which an annular trench 13a is formed on the inner peripheral part of an upper surface, and an annular solid welding material 14 which is composed of low melting point glass and has a diameter nearly equal to the inner diameter of the can 11 are prepared. The can is raised inversely, the welding material 14 is inserted in a part just above the window, and the window glass is stacked on the welding material. The can is raised normally, the welding material is fused and cooled, and the window glass is fixed to a part just below the window. When the fused welding material flows on the upper surface of the window glass toward the central part in the case that the window glass is welded, the annular trench 13a receives the welding material, and the flow is stopped on its way. As a result, the welding material does not flow inside the trench 13a, and the effective diameter of the window glass 13 becomes nearly equal to the inner diameter of the trench 13a.
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