发明名称 METHOD FOR PRODUCING PRINTED WIRING BOARD AND PRINTED WIRING BOARD PRODUCED BY THE METHOD
摘要 <p>PROBLEM TO BE SOLVED: To provide a method for producing a printed wiring board efficiently in which the relation between boring conditions and finishing state is stabilized, and a printed wiring board produced by that method. SOLUTION: Openings are made by etching the boring points of the copper foil in a copper clad multilayer plate, and an insulation layer exposed at the openings is vaporized and removed by means of laser while heating thus producing a printed wiring board.</p>
申请公布号 JP2001332867(A) 申请公布日期 2001.11.30
申请号 JP20000153299 申请日期 2000.05.24
申请人 HITACHI CHEM CO LTD 发明人 KAWAKAMI YUTAKA;SHIMIZU AKIRA;NAMATAME KAZUHIKO;TSUBOMATSU YOSHIAKI;INOUE FUMIO;OHATA HIROTO;AWANO YASUHIKO
分类号 B23K26/00;B23K101/42;H05K3/00;H05K3/46;(IPC1-7):H05K3/46 主分类号 B23K26/00
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