发明名称 |
METHOD FOR PRODUCING PRINTED WIRING BOARD AND PRINTED WIRING BOARD PRODUCED BY THE METHOD |
摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method for producing a printed wiring board efficiently in which the relation between boring conditions and finishing state is stabilized, and a printed wiring board produced by that method. SOLUTION: Openings are made by etching the boring points of the copper foil in a copper clad multilayer plate, and an insulation layer exposed at the openings is vaporized and removed by means of laser while heating thus producing a printed wiring board.</p> |
申请公布号 |
JP2001332867(A) |
申请公布日期 |
2001.11.30 |
申请号 |
JP20000153299 |
申请日期 |
2000.05.24 |
申请人 |
HITACHI CHEM CO LTD |
发明人 |
KAWAKAMI YUTAKA;SHIMIZU AKIRA;NAMATAME KAZUHIKO;TSUBOMATSU YOSHIAKI;INOUE FUMIO;OHATA HIROTO;AWANO YASUHIKO |
分类号 |
B23K26/00;B23K101/42;H05K3/00;H05K3/46;(IPC1-7):H05K3/46 |
主分类号 |
B23K26/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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