SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME, AND SUBSTRATE AND SEMICONDUCTOR CHIP

摘要

PROBLEM TO BE SOLVED: To provide a flip chip mount substrate having a reliable connection part. SOLUTION: A semiconductor device of a substrate mounted with a semiconductor chip comprises a bump having a projecting part which is formed on an electrode of the semiconductor chip, and a hole to insert the protrusion of the bump which is formed in an electrode of the substrate corresponding to the bump. The electrode of the substrate and the bump corresponding to the electrode are electrically connected through a conductive adhesive.