发明名称 |
Novel MCM -MLC technology |
摘要 |
Disclosed is a multilayer electronics packaging structure, especially for use in a multi chip module. By forming an overlap of signal conductors by the respective mesh conductors, an improved shielding effect is achieved and coupling between signal conductors is reduced. By increasing the via punch pitch such that multiple wiring channels are formed between adjacent vias, wirability is improved and the number of signal distribution layers may be reduced. The new structure thus shows improved electrical properties over the state-of-the-art structures, combined with a cost reduction of about 35%.
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申请公布号 |
US2001046125(A1) |
申请公布日期 |
2001.11.29 |
申请号 |
US20000740280 |
申请日期 |
2000.12.19 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
REHM SIMONE;GARBEN BERND;KLINK ERICH;THOMKE GISBERT;SHUTLER WILLIAM F. |
分类号 |
H01L23/538;H05K1/00;H05K1/02;(IPC1-7):H05K7/02 |
主分类号 |
H01L23/538 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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