| 摘要 |
<p>A wafer chuck mechanism, used to fix a semiconductor wafer in the chamber of an electronic beam semiconductor tester, wherein a placing surface (31a) of a chuck (31) allowing the semiconductor wafer (14) to be placed thereon is formed in a convex shape, and the peripheral edge part of the semiconductor wafer (14) put on the placing surface (31a) is pressed against the surface (31a) by a ring-shaped retainer (32), whereby the semiconductor wafer (14) is fixed to the chuck (31) along the convex-shaped placing surface (31a).</p> |
