DIE BONDING DEVICE

摘要

A die bonding device for mounting an electronic part (S) on a metal stem, comprising a bonding nozzle for sucking the electronic part (S) and placing the electronic part (S) on the part mounting surface of the stem, a stem mounting head allowing the stem to be mounted thereon, a heater part heating the electronic part (S) in the state where the electronic part (S) is disposed on the part mounting surface of the stem, and an imaging camera having an optical axis (L) extending so as to pass the part mounting surface of the stem disposed in the heater part and reciprocating along the direction of the optical axis (L).