| 摘要 |
A method for manufacturing a condenser microphone capable of directly bonding an FET chip on each cell of a wafer on the pattern on a printed circuit board, thereby preventing the occurrence of badness by the disconnection of the FET terminals, removing the generation of noise, and achieving the microminiaturization of the product. The method for manufacturing a condenser microphone having a case, a diaphragm ring, a diaphragm, a spacer, a supporter, a back-pole plate, a connection ring, an FET chip and a printed circuit board, includes the steps of: dividing a wafer into cells each having a predetermined size and forming the FET chip on each cell; fixing the FET chip on a corresponding position of the printed circuit board on which a conductive material is patterned; bonding drain, source and gate terminals formed on the bottom surface of the FET chip with the corresponding connected portions on the printed circuit board by means of a metal wire; molding the FET chip and the surface of the printed circuit board and testing the operation state thereof; and assembling the diaphragm ring, the vibration, the spacer, the supporter, the back-pole plate, the connection ring and the printed circuit board on which the FET chip has been bonded in the named order into the case.
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