发明名称 Method of artificially forming patina on copper
摘要 A method of artificially forming patina on a copper product surface comprising the steps of blowing granular sodium hydrogen carbonate powder onto the copper product surface to clean and roughen it; wetting the surface with water; and depositing granular sodium hydrogen carbonate powder onto the wet copper surface; thereby forming patina on the copper surface. The step of wetting the copper surface and the step of depositing granular sodium hydrogen carbonate powder onto the wet copper surface are preferably repeated several times. The copper surface is preferably covered with porous sheets during or after the above steps.
申请公布号 US6322636(B1) 申请公布日期 2001.11.27
申请号 US20000607932 申请日期 2000.06.30
申请人 THE HIRAOKA ENVIRONMENTAL SCIENCE LABORATORY 发明人 MATSUGU YUTAKA
分类号 B24C11/00;B44F9/10;C23C22/63;C23C22/68;C23C22/73;C23C22/78;C23C22/82;(IPC1-7):C23C22/48 主分类号 B24C11/00
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