发明名称 SUBSTRATE SEPARATING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a substrate separating device capable of surely separating a substrate without giving an adverse effect to the substrate, in the case of separating the substrate of soft thin plate state from an auxiliary jig. SOLUTION: This substrate separating device 1 reduces ionized compressed air 14 by an air knife 9 injected to a temporary fixed mating joint between a substrate 24 and an auxiliary jig 25, so as to separate the substrate 24. By directly injecting air toward the temporary fixed mating joint, the substrate is surely separated. Since separation is by air, mechanical contact relating to the substrate 24 is eliminated, so that the substrate 24 can be prevented from flawing. Since air is the ionized compressed air 14, static electricity generated in the case of separation is neutralized, so that a bad influence given to a thin film electrode or the like formed on the substrate 24 can be impeded by performing its static elimination.
申请公布号 JP2001328039(A) 申请公布日期 2001.11.27
申请号 JP20010083712 申请日期 2001.03.22
申请人 SHARP CORP 发明人 KAWAKAMI YASUYUKI
分类号 G02F1/1333;B23P19/04;B65H41/00;G09F9/00;(IPC1-7):B23P19/04;G02F1/133 主分类号 G02F1/1333
代理机构 代理人
主权项
地址