| 摘要 |
In a method of fixing a part on a main base, the method comprises the step of mechanically fixing the part on the main base by using solder. The main base preferably may be made of resin while the part preferably may be made of one where the solder enables to adhere to the part. The resin of the main base comprises, for example, a liquid-crystal polymer. The main base may comprise an optical base for use in an optical pickup. The part may comprise a leaf spring or a photodiode (PD) base to which a photodiode is adhered.
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