| 摘要 |
PROBLEM TO BE SOLVED: To obtain an epoxy resin composition for sealing a semiconductor, excellent in moldability such as fluidity and curability, flame retardancy, solder resistance, and characteristics in high-temperature preservation without containing a halogen-based flame retardant and an antimony-based compound. SOLUTION: This epoxy resin composition for sealing the semiconductor is characterized in that the composition consists essentially of (A) an epoxy resin, (B) a phenol resin, (C) a curing accelerator, (D) an inorganic filler, (E) a phosphazene compound and (F) a metal complex obtained by coordinating a ligand selected from a naphthenic acid, acetylacetonate, phthalocyanine and thiocyanic acid with a metal element selected from Co, Cu, Zn, Ni, Mn and Fe.
|
