| 摘要 |
This invention relates to a method of potting a component, namely encasing a component ( 110 ) in a potting compound ( 112 ) with, optionally, all or some of the voids in the component also being filled with potting compound. In particular, the present invention relates to potting a component that will be subject to high electric field strengths in use. The method comprises introducing an inert gas into a first pressure vessel ( 100 ) containing the component to be potted thereby to create an inert environment, introducing a potting compound into the first pressure vessel and allowing the potting compound to cure in the inert environment. |
