| 摘要 |
PROBLEM TO BE SOLVED: To solve problem that a plating liquid 3 soaks into the side of cathode 2 B quickly by a capillary phenomenon, pollutes the cathode 2 B and a semiconductor wafer W, and consequently that the cathode 2 B must be changed very frequently because when the semiconductor wafer W is released in order to be delivered to a carrying substrate P by means of raising a clamping mechanism, the semiconductor wafer W rises from the cathode 2 B and is placed on a sealing member 2D by an elasticity of the sealing member 2D. SOLUTION: An electrolytic plating equipment 10 pulls up a copper plated semiconductor wafer W from a plating liquid 11 in an electrolytic plating bath 12 through a solid support 18, adsorbs and holds the semiconductor wafer W by using a vacuum chuck 24 provided in the solid support 18, and then, lifts up the semiconductor wafer W at a stretch from a mounting part 18A of the solid support 18 through the vacuum chuck 24.
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