| 摘要 |
PROBLEM TO BE SOLVED: To provide a plating method and a plating liquid treating equipment which can surely remove bubbles formed between a treating liquid and a surface to be treated of a substrate to be treated. SOLUTION: In a plating unit M1, a driver 61 is arranged to keep a wafer W right over a plating liquid tank 42 and rotate the wafer W in an approximately horizontal plane, and a cylinder 67 for moving the driver 61 approximately horizontally is attached to the driver 61. Bubbles attached to a surface to be plated of a wafer W are removed, by means of rotating the wafer W along with moving the wafer W from the plating position (IV) above a central axis of a plating liquid tank 42 to a decentered position (V) from a center of the plating liquid tank approximately horizontally, by means of driving the cylinder 67 in a contacted condition for the surface to be plated of the wafer W with a liquid surface of the plating liquid.
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