| 摘要 |
PROBLEM TO BE SOLVED: To prevent a solder bridge from occurring when mounting an SOP on a printed board. SOLUTION: In a printed board, a land for an electronic part small in package size is arranged inside a land for an electronic part large in package size, and the lands to which the terminals of the same functions of the above electronic parts are to be connected out of the land for an electronic part arranged and the land within the electronic part arranged inside are connected with each other by pattern wiring. The land for an electronic part arranged inside is arranged in parallel with the direction of disposition of the lands for an electronic part arranged outside, and also that inner land is arranged to the positioned between the above outer lands.
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