| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit board member for improving the connection reliability in a via hole of the circuit board and for making the dimension of the via hole, and to provide a method of manufacturing a circuit board with high reliability by using the member for a circuit board. SOLUTION: In the circuit board member (1) formed by providing macromolecular films on both surfaces of a prepreg, a diamond-like carbon film layer (3a) is provided on both surfaces or one surface of the macromolecular film (2), and the surface of the macromolecular film (2) on the diamond-like carbon film layer side is contacted with the prepreg (4). By constituting this, there can be provided the circuit board member for improving the connection reliability of the circuit board and for making the dimension of the via hole. A through hole is formed on a prescribed position on the circuit board member, a conductive paste is applied to the through hole, and then the macromolecular film is removed from the circuit board member, thereby forming the prepreg. By using the prepreg formed in this way, the circuit board with high reliability can be manufactured. |
