| 摘要 |
PROBLEM TO BE SOLVED: To provide a copper alloy excellent in electric conductivity, tensile strength and flexural fatigue resistance, and suitable for IC lead pin for PGA(pin grid array) mounted on a plastic substrate. SOLUTION: The copper alloy is any of the following: a copper alloy consisting of, by weight, 0.05-0.5% Zn, 0.05-0.5% Mg and the balance Cu with inevitable impurities; a copper alloy consisting of 0.1-1.0 wt.% Sn and the balance Cu with inevitable impurities; a copper alloy consisting of, by weight, 0.1-1.0% Sn, 0.1-0.6% Ag and the balance Cu with inevitable impurities; a copper alloy consisting of, by weight, 2.1-2.6% Fe, 0.05-0.02% Zn, 0.015-0.15% P and the balance Cu with inevitable impurities; and a copper alloy consisting of 0.4-1.1 wt.% Cr and the balance Cu with inevitable impurities. This copper alloy has >=50% IACS electric conductivity and 400-650 MPa tensile strength. |
