| 摘要 |
PROBLEM TO BE SOLVED: To obtain thin sheet made of a low thermal expansion alloy for electronic parts excellent in resist adhesion by controlling the atom ratio, C/Fe, in the outermost surface layer of a thin sheet to be <1.8, and to obtain electronic parts. SOLUTION: As to this thin sheet made of low thermal expansion alloy for electronic parts, in an Fe-Ni series low thermal expansion alloy thin sheet containing, by mass, 30 to 52% Ni, C/Fe, i.e., the ratio between the concentration of C atoms and the concentration of Fe atoms in the outermost surface layer of the thin sheet is <1.8, or, in an Fe-Ni-Co series low thermal expansion alloy thin sheet containing, by mass, 26 to 38% Ni and 1 to 20% Co, C/Fe, i.e., the ratio between the concentration of C atoms and the concentration of Fe atoms in the outermost surface layer of the thin sheet is <1.8. The electronic parts are obtained by subjecting the above low thermal expansion alloy thin sheet to etching and forming open pores.
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