COMPOSITION FOR FILM FORMATION AND MATERIAL FOR INSULATION FILM FORMATION

摘要

PROBLEM TO BE SOLVED: To provide a composition for film formation which gives a cured film excellent in heat resistance, electrical insulation properties (with a relative permittivity of 3 or lower), and resistances to cracks and CMP and is useful as a material for insulation film formation. SOLUTION: This composition for film formation is a mixture of (I) a polyorganosiloxane/polyimide hybrid obtained by subjecting (B) a silane compound to hydrolysis and condensation in the presence of (A) a polyamic acid and/or polyimide having a hydrolyzable organosilyl group and (II) a hydrolyzate and/or condensate of (B) the silane compound.