| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a wafer polishing apparatus capable of cleaning the surface of a holding head more suitably and more thoroughly without deteriorating its shape, and preventing a cleaning solution from scattering. SOLUTION: The wafer polishing apparatus is equipped with the holding head 20, a cleaning device 30 for cleaning the surface 22 of the holding head 20, and a polishing platen 15 with a polishing surface 16. The polishing apparatus polishes a wafer 10 through the manner in which the polishing surface 16 of the polishing platen 15 is brought into contact with the polished surface 11 of the wafer 10 with prescribed pressure, and the wafer 11 and the polishing platen 15 are relatively moved together to polish the polished surface 11 of the wafer 10. The cleaning device 30 is equipped with a high-pressure jet nozzle 32 disposed in an inner space 35a to jet out a cleaning solution with high pressure to clean the surface 22, and a cleaning solution recovery tank 35 disposed around the side of the holding head 20 so as to prevent the cleaning solution from scattering when the holding head 20 is relatively moved to get into the inner space 35a.</p> |
