| 摘要 |
PROBLEM TO BE SOLVED: To provide a liquid treating unit in which bubbles are hard to be trapped on a surface to be treated, and a liquid treating unit in which the trapped bubbles on the surface to be treated are easily removed. SOLUTION: This liquid treating unit includes a seal ring 80 providing a sealing member 81, which is located at the top of a seal ring 80, seals a gap between a wafer W held by a bottom end 62a of a holder 62 and the bottom end 62a, and is arranged inside of a holder 62 of a face down type of a plating unit M1. The shape of containing part of the sealing member with a bottom face of a wafer W is composed of a horizontal top face and a internal circumferential side face formed to be perpendicular to the top face.
|
