| 摘要 |
PROBLEM TO BE SOLVED: To provide an apparatus for an electroless plating capable of suppressing a change of a plating liquid with time and carrying out electroless plating homogeneously and accurately, and provide a method for forming a conductive film. SOLUTION: The apparatus for the electroless plating is composed of the upper apparatus 20 and the lower apparatus 10. The lower apparatus 10 is composed of a rotatable spin table 11 with a semiconductor wafer W, a heater 11a and pipe arrangements 15, 16 and 17 which supply (a) pure water, (a) a pre-treating liquid and an electroless plating liquid, respectively on the wafer. The upper apparatus 20 is composed of a plating cup 21, a heater 21a, a stirrer 22, pipe arrangements 24, 25, 26 and 27 which supply the pure water, the pre- treating liquid and the electroless plating liquid and an inert gas, respectively in the plating cup 21, and a sealing material 23.
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