MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a method for printing a projected part on a wafer or substrate made of semiconductor. SOLUTION: (a) An UBM layer 12 is formed on aluminum 11 of a surface of a wafer 1 in an electroless plating nickel/gold application method. (b) The surface of the wafer 1 is covered and bonded with a synthetic adhesive tape 2a. (c) A hole is formed by laser perforation at an adequate position (corresponding to USB layer 12) of the synthetic adhesive tape 2a. (d) The synthetic adhesive tape 2a has a blind hole 2a1 through the laser perforation. (e) A tin paste is applied in the blind hole 2a1 by using an application plate 4. (f) The tin paste is melted into a tin piece through boxing welding at high temperatures. (g) The synthetic adhesive tape 2a is flaked out and then only the tin piece 6 remains in a projected state on the wafer 1. (h) After second boxing welding at high temperatures, the tin piece 6 forms a spherical tin ball 7 on the UBS layer 12. These processes are carried out at high speed conveniently and the production time can be saved greatly.