| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat-resistant mold release composition whose mold release property can be maintained even in a heated state using heat-radiating rays in the fields of food packaging materials, building materials, materials related to precision apparatuses, and materials used for processing parts, such as drying, baking, melting and fusing, and the like. SOLUTION: This heat-resistant mold release composition characterized by comprising a fluororesin and a heat-resistant inorganic compound such as titania. The inorganic compound preferably has the property of at least one of the absorption, reflection and transmission of UV light and has a flaky shape. The content of the inorganic compound is preferably >=0.1 wt.%.
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