发明名称 |
VERFAHREN ZUM HERSTELLEN INTEGRIERTE SCHALTUNGSANORDNUNGEN |
摘要 |
A method for producing integrated circuit devices including the steps of producing a plurality of integrated circuits on a wafer, each of the integrated circuits including a multiplicity of pads and thereafter slicing the wafer, thereby to define a plurality of integrated circuit elements, and wherein the step of slicing exposes sectional surfaces of the multiplicity of pads. Apparatus for carrying out the method and integrated circuit devices are also described and claimed. |
申请公布号 |
DE69231785(T2) |
申请公布日期 |
2001.11.15 |
申请号 |
DE1992631785T |
申请日期 |
1992.09.14 |
申请人 |
SHELLCASE LTD., JERUSALEM |
发明人 |
BADEHI, PIERRE |
分类号 |
H01L25/18;H01L21/301;H01L21/78;H01L21/98;H01L25/065;H01L25/07 |
主分类号 |
H01L25/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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