Device with functional component has insulating substrate with recess, wiring layer formed as pattern on substrate surface extending continuously from recess floor to substrate surface

摘要

The device has an insulating substrate (11) with a recess (12) on one surface and a wiring layer (13) formed as a pattern on the substrate surface. The wiring layer extends continuously from the floor of the recess via the side of the recess to the surface of the substrate. The component is mounted in the recess in flip-chip manner. The silicon substrate has an insulating film at least on the recess floor and sides and on the top of the substrate. Independent claims are also included for the following: a method of manufacturing a base for accommodating a functional component and a method for manufacturing a device with a functional component.