| 发明名称 |
Process for reducing extraneous metal plating |
| 摘要 |
Printed circuit boards, cards and chip carriers are fabricated by treating an already circuitized substrate with a swelling agent, then treating the circuitized substrate with a composition containing an alkaline permanganate, a chromate and/or chlorite and then applying a metal layer to coat the circuitized portion of the substrate.
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| 申请公布号 |
US2001040047(A1) |
申请公布日期 |
2001.11.15 |
| 申请号 |
US20010917701 |
申请日期 |
2001.07.31 |
| 申请人 |
KONRAD JOHN JOSEPH;PAPATHOMAS KONSTANTINOS I.;WELLS TIMOTHY LEROY;WILSON JAMES WARREN |
发明人 |
KONRAD JOHN JOSEPH;PAPATHOMAS KONSTANTINOS I.;WELLS TIMOTHY LEROY;WILSON JAMES WARREN |
| 分类号 |
C23C18/16;H05K3/18;H05K3/24;H05K3/26;(IPC1-7):H05K1/00;B05D5/12;H02B1/24 |
主分类号 |
C23C18/16 |
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