| 发明名称 |
METHOD FOR SOLDERING A FIRST METAL ELEMENT AND A SECOND METAL ELEMENT USING A SOLDERING MATERIAL AND A SEMICONDUCTOR ASSEMBLY DEVICE |
| 摘要 |
In a first heating process, intermetallic partial phases are formed between the metal elements and the soldering material and, in a second heating process, the soldering material is transformed in its entirety into one or more intermetallic phases between the metal elements.
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| 申请公布号 |
WO0186714(A1) |
申请公布日期 |
2001.11.15 |
| 申请号 |
WO2001DE01650 |
申请日期 |
2001.05.03 |
| 申请人 |
INFINEON TECHNOLOGIES AG;HUEBNER, HOLGER;KRIPESH, VAIDYANATHAN |
发明人 |
HUEBNER, HOLGER;KRIPESH, VAIDYANATHAN |
| 分类号 |
B23K20/02;B23K20/22;H01L21/60;(IPC1-7):H01L21/60;B23K20/00;H01L21/603;B23K1/008 |
主分类号 |
B23K20/02 |
| 代理机构 |
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