| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing a semiconductor free from a halogen and antimony, excellent in flame retardancy, fast curing properties, flowability, humidity resistance and high-temperature storage characteristics, and suitable for insertion mounting and surface mounting. SOLUTION: The epoxy resin composition comprises as essential ingredients (A) an epoxy resin, (B) a phenolic resin, (C) a curing accelerator comprising associated molecules of a tetra-substituted phosphonium (X), a compound (Y) bearing at least two phenolic hydroxyl groups in one molecule and a conjugate base of the compound (Y) bearing at least two phenolic hydroxyl groups in one molecule, the conjugate base comprising a phenoxide type compound obtained by removing one hydrogen from the compound (Y) bearing at least two phenolic hydroxyl groups in one molecule, (D) red phosphor or a red phosphor-based flame-retardant, and (E) an inorganic filler.
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