| 摘要 |
<p>PROBLEM TO BE SOLVED: To eliminate a tray when an assembly to be processed in which plastic IC cards, etc., are laid to overlap each other is heated, pressurized, molded, and conveyed. SOLUTION: Double secular plates 94a-94b are held between IC cards 93a-93e, and single secular plates 92a and 92b with cushioning paper 91a and 91b are arranged on the lowermost side and the uppermost side to constitute the assembly 96. The width of the lower side secular plate 92a is made to be larger than the clearance between belts 61 and 62, support part 92aA and 92aB at both ends of the plate 92a are mounted on the belts 61 and 62 so that the assembly 96 can be supported, and the lower side cushioning paper 91a, with its width made smaller than the clearance between the belts 61 and 62, is made to be inserted into the clearance.</p> |
