发明名称 Interposer assembly
摘要 An interposer assembly includes an insulating plate with passages extending through the thickness of the plate and projections extending into the passages. Metal contacts are confined in the passages by the projections. The contacts include noses that project outwardly from the plate for engagement with contact pads on overlying and underlying circuit members.
申请公布号 US6315576(B1) 申请公布日期 2001.11.13
申请号 US20010753734 申请日期 2001.01.02
申请人 INTERCON SYSTEMS, INC. 发明人 NEIDICH DOUGLAS A.
分类号 H01R12/04;H01R12/16;H01R13/24;H05K7/10;(IPC1-7):H01R12/00 主分类号 H01R12/04
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