发明名称 |
Plate type heat pipe and a cooling system using same |
摘要 |
A plate type heat pipe having a hermetically sealed container installed so as to face a printed board on which at least one part to be cooled is mounted, wherein a block which passes through at least one main surface portion of the container is arranged within the container in a corresponding portion to the part(s) to be cooled.
|
申请公布号 |
US6317322(B1) |
申请公布日期 |
2001.11.13 |
申请号 |
US20000640460 |
申请日期 |
2000.08.15 |
申请人 |
THE FURUKAWA ELECTRIC CO., LTD. |
发明人 |
UEKI TATSUHIKO;YAMAMOTO MASAAKI;IKEDA MASAMI |
分类号 |
H01L23/427;H05K7/20;(IPC1-7):H05K7/20 |
主分类号 |
H01L23/427 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|