发明名称 HEAT SENSITIVE STENCIL BASE PAPER AND DIE MAKING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a uniformly dense printed matter by a method wherein the adhesion between a heat sensitive stencil paper and a thermal head is improved so as to obtain favorable perforations in the die making of the heat sensitive stencil with the thermal head. SOLUTION: In the die making method of the heat sensitive stencil paper, which is formed by laminating a thermoplastic resin film and a porous support to each other and in which the thermoplastic resin film is meltingly perforated by being brought into close contact with the thermal head through the depression from the porous support side with a platen roller, the porous support of the heat sensitive stencil base paper is impregnated with a liquid selected from an emulsion prepared under the condition that the oil-based component (1) having a viscosity of 400 mPa.s or more and an oil content/water content (2) varies 35 to 100 wt.% 0 to 65 wt.% or with a gel-like matter, which is fluidized through the application of stress thereto.
申请公布号 JP2001315459(A) 申请公布日期 2001.11.13
申请号 JP20000135413 申请日期 2000.05.09
申请人 RISO KAGAKU CORP 发明人 HASHIMOTO HIROHIDE
分类号 B41C1/055;B41N1/24;(IPC1-7):B41N1/24 主分类号 B41C1/055
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