| 摘要 |
A wire bonding method for connecting first and second points with a wire, comprising the steps of: connecting the wire to the first bonding point, raising the capillary and performing a reverse operation so as to move the capillary in the opposite direction from the second bonding point, raising the capillary obliquely upward toward the second bonding point (and then raising the capillary further), then raising the capillary and performing another reverse operation so as to move the capillary in the opposite direction from the second bonding point, and raising and then moving the capillary toward the second bonding point, thus connecting the wire to the second bonding point; thus forming a stable wire loop that has a high shape retention strength.
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