| 发明名称 |
Forming pin contacts to electronic devices |
| 摘要 |
A ball is formed at the end of a wire 10 extending though the bore of a wirebonding tool 12, the ball is brought into contact with the contact surface, the ball is then extruded into the bore during thermocompression bonding to form a pin 11. The wire is subsequently disconnected from the pin. |
| 申请公布号 |
GB2362036(A) |
申请公布日期 |
2001.11.07 |
| 申请号 |
GB20010008418 |
申请日期 |
2001.04.03 |
| 申请人 |
* PIXELFUSION LIMITED;* CLEARSPEED TECHNOLOGY LIMITED |
发明人 |
ELWYN PAUL MICHAEL * WAKEFIELD |
| 分类号 |
H01L21/48;H01L21/60;H05K3/40;(IPC1-7):H01L21/607;H05K3/32;B23K20/00 |
主分类号 |
H01L21/48 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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