发明名称 |
LOW TEMPERATURE LOCAL HEATER FOR BONDING SILICON/SILICON SUBSTRATE AND METHOD FOR THE SAME |
摘要 |
PURPOSE: A low temperature local heater for bonding a silicon/silicon substrate and a method for the same are provided to improve bonding efficiency by removing a non-bonding area in a direct bonding process. CONSTITUTION: A halogen lamp(12) is installed in a center portion of a collector(11). The collector(11) is formed in a casing(10) for condensing heat and beam to a substrate. A process gas is provided to control atmosphere through a conductive tube(13). The conductive tube(13) is connected with one side of the casing(10). The substrate is passed through the halogen lamp(12) by a belt(20) connected with a motor(23). A support plate(21) is adhered to an upper face of the belt(20). A quartz plate(40) is loaded on the substrate. A plurality of sensors(31,32) is formed at a bottom portion of the collector in order to detect a temperature of the substrate. A controller(50) is sued for controlling the motor(23).
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申请公布号 |
KR20010095621(A) |
申请公布日期 |
2001.11.07 |
申请号 |
KR20000018889 |
申请日期 |
2000.04.11 |
申请人 |
SONG, OH SUNG |
发明人 |
LEE, JIN U;MIN, HONG SEOK;SONG, OH SUNG |
分类号 |
H01L21/265;(IPC1-7):H01L21/265 |
主分类号 |
H01L21/265 |
代理机构 |
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主权项 |
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地址 |
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