发明名称 LOW TEMPERATURE LOCAL HEATER FOR BONDING SILICON/SILICON SUBSTRATE AND METHOD FOR THE SAME
摘要 PURPOSE: A low temperature local heater for bonding a silicon/silicon substrate and a method for the same are provided to improve bonding efficiency by removing a non-bonding area in a direct bonding process. CONSTITUTION: A halogen lamp(12) is installed in a center portion of a collector(11). The collector(11) is formed in a casing(10) for condensing heat and beam to a substrate. A process gas is provided to control atmosphere through a conductive tube(13). The conductive tube(13) is connected with one side of the casing(10). The substrate is passed through the halogen lamp(12) by a belt(20) connected with a motor(23). A support plate(21) is adhered to an upper face of the belt(20). A quartz plate(40) is loaded on the substrate. A plurality of sensors(31,32) is formed at a bottom portion of the collector in order to detect a temperature of the substrate. A controller(50) is sued for controlling the motor(23).
申请公布号 KR20010095621(A) 申请公布日期 2001.11.07
申请号 KR20000018889 申请日期 2000.04.11
申请人 SONG, OH SUNG 发明人 LEE, JIN U;MIN, HONG SEOK;SONG, OH SUNG
分类号 H01L21/265;(IPC1-7):H01L21/265 主分类号 H01L21/265
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