发明名称 METHOD FOR CONSTRUCTING AN OPTOELECTRONIC ASSEMBLY
摘要 A package for optical components and a method for making the package are disclosed. The package comprises a quasi-planar substrate having a positioning floor, a platform and an optional ring frame of precisely determined height. Optical components are picked and placed on a substrate floor, a raised platform and frame. A flexure assembly allows fine positioning of components requiring critical optical alignment.
申请公布号 EP1151339(A1) 申请公布日期 2001.11.07
申请号 EP20000915691 申请日期 2000.01.06
申请人 LIGHTLOGIC, INC. 发明人 VERDIELL, JEAN-MARC
分类号 B23K1/00;B23K1/005;B23K101/36;G02B6/42;H01S5/022 主分类号 B23K1/00
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