发明名称 |
LOAD DRIVING CIRCUIT |
摘要 |
PROBLEM TO BE SOLVED: To reduce the effect of a wiring resistance in a wiring pattern connected to each semiconductor switching element when driving the semiconductor switching elements for load driving in parallel. SOLUTION: A wire connection part 501a connected to a power supply in the wiring pattern 501 is disposed near one of IPDA and IPDC arranged at the ends of the plurality of IPDA to IPDC. A wire connection part 502a connected to a motor 500 in the wiring pattern 502 is disposed near the other of the IPDA and IPDC. |
申请公布号 |
JP2001310720(A) |
申请公布日期 |
2001.11.06 |
申请号 |
JP20000130813 |
申请日期 |
2000.04.28 |
申请人 |
DENSO CORP |
发明人 |
HATTORI HIROSHI;KABUNE HIDEKI |
分类号 |
B60R16/02;B60T8/1761;B60T8/34;B60T8/96;H01L25/07;H02J3/00;H02M1/00;H03K17/12;H03K17/687 |
主分类号 |
B60R16/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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