发明名称 LOAD DRIVING CIRCUIT
摘要 PROBLEM TO BE SOLVED: To reduce the effect of a wiring resistance in a wiring pattern connected to each semiconductor switching element when driving the semiconductor switching elements for load driving in parallel. SOLUTION: A wire connection part 501a connected to a power supply in the wiring pattern 501 is disposed near one of IPDA and IPDC arranged at the ends of the plurality of IPDA to IPDC. A wire connection part 502a connected to a motor 500 in the wiring pattern 502 is disposed near the other of the IPDA and IPDC.
申请公布号 JP2001310720(A) 申请公布日期 2001.11.06
申请号 JP20000130813 申请日期 2000.04.28
申请人 DENSO CORP 发明人 HATTORI HIROSHI;KABUNE HIDEKI
分类号 B60R16/02;B60T8/1761;B60T8/34;B60T8/96;H01L25/07;H02J3/00;H02M1/00;H03K17/12;H03K17/687 主分类号 B60R16/02
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